Taiwan and Japan join forces to seize the CPO market opportunity in AI silicon photonics!

The rapid growth of AI computing, high-performance computing, and data centers is increasing the demand for faster and more energy-efficient data transmission technologies. In response to this growing demand, TOYO (Stock Code: 7942) has formed a strategic alliance with Japan-based Suruga Seiki to jointly promote a new generation of Co-Packaged Optics (CPO) optical coupling alignment platforms equipment.

CPO technology integrates optical components and switch chips within the same package, helping reduce electrical signal transmission distances, power consumption, and latency. This makes CPO an important technology for next-generation AI infrastructure and high-speed data centers.

Combining Precision Motion and Optical Alignment Technologies

A key challenge in CPO manufacturing is achieving accurate alignment between fiber arrays and optoelectronic chips. Nanometer-level positioning is essential for improving optical coupling efficiency and manufacturing yield.

The collaboration combines the complementary technologies of both companies. TOYO contributes its expertise in high-precision linear motor modules and multi-axis integration technology, enabling accurate and stable nanometer-level positioning.Suruga Seiki brings its advanced fine-tuning platform, high-speed optical searching algorithms, and optical power feedback measurement technology, supporting precise and efficient optical coupling alignment.

Improving CPO Manufacturing Efficiency

By integrating precision motion hardware with advanced optical alignment and measurement technologies, the partnership aims to improve the efficiency of CPO optical coupling processes.

The collaboration will further shorten optical searching cycles, reduce process losses, and advance CPO optical coupling processes toward high-efficiency automated mass production.