
Toyo Alignment Stage is a critical component in the semiconductor industry that is used to align and position wafers accurately during the manufacturing process. The alignment stage is typically used in the front-end of the semiconductor manufacturing process, where wafers are patterned and etched. The alignment stage uses a combination of mechanical and optical techniques to ensure that the wafers are precisely aligned with the lithography equipment. The alignment stage is a critical component of the semiconductor manufacturing process, as it ensures that the wafers are accurately positioned and aligned, which is essential for producing high-quality semiconductor devices.
LXY series is a low-resistance friction design equipped with an iron core linear motor. Its appearance is light weight and has a large hollow structure design. Due to large hollow design it can be processed on both sides and placed in an optical inspection machine.
Diverse track designs such as built-in rails, crossed roller guides, and standard linear rails can be selected to support coreless rails.
Repeatability : ±0.25 μm
Speed Ripple : 300 mm/s
Plane Accuracy :±2 μm
Total Height : 44 mm
Maximum Line Speed: 1 m/s
Orthogonality : ±10 arc sec.
| Model | ||||
| Travel(mm) | ||||
| Accuracy(μm) | ||||
| Repeatability(μm) | ||||
| Straightness(μm) | ||||
| Flatness(μm) | ||||
| Maximum Speed(mm/s) | ||||
| Continuous Force(N) | ||||
| Peek Force(N) | ||||
| Load Capacity(kg) | ||||
| Model | |
| Travel(mm) | |
| Accuracy(μm) | |
| Repeatability(μm) | |
| Straightness(μm) | |
| Flatness(μm) | |
| Maximum Speed(m/s) | |
| Maximum acceleration(m/s2) | |
| Continuous Force(N) | |
| Peek Force(N) | |
| Load Capacity(kg) |